1、 The anti-static ability of the chip is poor, and the anti-static index of the LED bead depends on the LED emitting chip itself, which is basically unrelated to the expected packaging process of the packaging material, or the influencing factors are very small and subtle; LED lights are more susceptible to electrostatic damage, which is related to the distance between the two pins. The distance between the two electrodes of the bare crystal of LED chips is very small, usually within 100 micrometers, while the distance between LED pins is about two millimeters. When electrostatic charges need to be transferred, the larger the distance, the easier it is to form a large potential difference, which is high voltage. Therefore, sealed LED lights are often more prone to electrostatic damage accidents. 2、 During the high-temperature crystallization process of chip epitaxial defects in LED epitaxial wafers, impurities are introduced into the substrate, residual sediment in the MOCVD reaction cavity, peripheral gas, and Mo source. These impurities penetrate into the epitaxial layer, preventing the nucleation of gallium nitride crystals, forming various epitaxial defects, and ultimately forming small pits on the surface of the epitaxial layer. These will also seriously affect the crystal quality and performance of the epitaxial film material. 3、 The processing of residual electrodes for chip chemicals is a key process in the production of LED chips, including cleaning, evaporation, yellowing, chemical etching, fusion, and grinding. It can come into contact with many chemical cleaning agents. If the chip is not cleaned thoroughly enough, harmful chemicals can remain. These harmful chemicals will undergo electrochemical reactions with the electrodes when the LED is powered on, leading to phenomena such as dead lights, light decay, dimming, and blackening. Therefore, identifying residual chip chemicals is crucial for LED packaging factories. 4、 The damage of LED chips can directly lead to LED failure, so improving the reliability of LED chips is crucial. During the evaporation process, it is sometimes necessary to use a spring clamp to fix the chip, which can result in clamping marks. If the yellow light operation is not fully developed and there are holes in the light mask, there will be residual excess metal in the emitting area. In the early stage of the grain production process, various operations such as cleaning, evaporation, yellowing, chemical etching, fusion, grinding, etc. must use tweezers, flower baskets, carriers, etc., so there may be scratching of the grain electrode. The impact of chip electrodes on solder joints: The chip electrodes themselves are not firmly evaporated, resulting in electrode detachment or damage after soldering; The poor solderability of the chip electrode itself can lead to solder ball failure; Improper chip storage can lead to electrode surface oxidation, surface contamination, and other issues. Minor contamination of the bonding surface can affect the diffusion of metal atoms between the two, leading to failure or solder failure.