1. UV LED chip

Ultraviolet LED epitaxial wafers undergo semiconductor manufacturing processes such as photolithography, etching, deposition, and annealing to form chips that can be cut and separated. If the substrate is non-conductive sapphire, the p-electrode is formed by depositing a suitable metal material, while the n-electrode needs to etch the p-type layer and the active area, and the electrode material is deposited to form a front-mounted chip with a planar structure; Chips, vertical structure chips for transfer substrates, etc., see the attachment table for a summary of chip-related standards.

2. UV LED package
The UV LED packaging technology is similar to the visible LED process, and the two main issues now are thermal management and light extraction. Product packaging forms are more diverse. According to the type of packaging materials, it can be divided into organic packaging, semi-inorganic packaging and all-inorganic packaging. Like traditional packaging, organic packaging uses organic materials such as silica gel, silicone resin or epoxy resin for packaging. The technology is relatively mature, including products such as Lamp, SMD, and ceramic molding. Sealing materials and optical materials need to increase UV resistance.
The semi-inorganic package uses organic silicon materials and inorganic materials such as glass, and the placement of the lens is realized by coating glue around the substrate. If the epoxy lens is replaced by a glass lens, the lifespan can be increased from 5000 hours to 20000 hours (R&D level), because the UV light increases