csp package features:

 (1) The csp package memory is not only small, but also thinner. The most effective heat dissipation path from the metal substrate to the heat sink is only 0.2 mm, which greatly improves the reliability of the memory chip after long-term operation, and the line impedance is significantly reduced. , the chip speed has also been greatly improved.

 (2) The central pin form of the CSP packaged memory chip effectively shortens the transmission distance of the signal, and its attenuation is reduced accordingly, and the anti-interference and anti-noise performance of the chip can also be greatly improved, which also makes the CSP access time ratio. BGA improved by 15%-20%.

 (3) In the CSP packaging method, the memory particles are soldered to the PCB board one by one through solder balls. Due to the large contact area between the solder joints and the PCB board, the heat generated by the memory chip during operation can be easily removed. Conducted to the PCB board and dissipated.