The chemical materials used in the wafer production process are a crucial factor in determining all performance indicators of LED light-emitting diodes. A 2-inch wafer can cut over 6000 LED chips, with only a few chips having different performance indicators compared to the overall design. And the differences in color, brightness, and voltage drop among chips manufactured by an excellent chip manufacturer are very small. After the packaging of LED chips is completed, there may be significant differences in many of their performance indicators, such as perspective. In addition, the impact of packaging materials is also significant, for example, silicone resin has better performance than epoxy resin.

Classification ability

Excellent LED manufacturers not only manufacture high-quality chips, but also have the ability to classify and package LEDs based on their color, brightness, voltage drop, and viewing angle. High quality LED suppliers will provide customers with products with consistent working characteristics, while lower quality LED suppliers can only provide LEDs similar to "mixed packaging".

For high-end applications with strict quality requirements, such as airport runway boundary lights, they must meet FAA level color and brightness specifications. To ensure performance and safety, the consistency of LED packaging is also strictly limited. The use of LED with poor packaging grade in demanding applications can lead to a series of inconsistent issues such as premature failure, which is likely to lead to major accidents. In order to avoid equipment downtime and ensure that the LED specified in the design has reliable operating characteristics, it is important to avoid the use of "mixed packaging" products in high-end and quality demanding applications.

Product supporting capacity

In addition to discrete LEDs, the assembly and power supply of LEDs have a significant impact on their performance, brightness, and color indicators. Due to factors such as environmental temperature, working current, circuit structure, voltage spikes, and environmental factors that can affect the performance indicators of light-emitting diodes, appropriate circuit design and assembly are key to protecting LEDs and ensuring their performance. LED manufacturers also use various technologies and materials to design circuit structures and assemblies. In most cases, differences in the experience of LED assemblers can lead to differences in overall performance and reliability among LED manufacturers in the same application.

With the rapid growth of LED demand, manufacturers and assembly plants serving the global market are also rapidly increasing. Unfortunately, the surge in support manufacturers not only heavily adopt low-quality LEDs, but also have relatively limited experience in packaging and LED design engineers. Therefore, in addition to accurately selecting LED suppliers through existing experience, OEM manufacturers must also examine their circuit design and assembly technology to ensure compliance with design specifications and whether the design provides sufficient heat dissipation capacity, as the main factor leading to LED failure and inconsistent performance is overheating.