What are the cooling and cooling methods of glowing diodes? In the semiconductor lighting device, high -power and high -brightness glow diode (LED) is usually used as a light source. When the current in the light emitting diode is used in current, the electronics and the cave will directly compound. The advantages of long service life are widely used in the field of lighting.

However, the current photoelectric conversion efficiency is relatively low, and the proportion of a large proportion is transformed into a thermal energy, so the power density on the LED chip is very high. Large power density also puts forward high requirements for the heat dissipation of the device. The heat dissipation problem of packaging parts in the light -emitting diodes has become a major issue that affects its industrialization development.

LED's heat dissipation mechanism generally has these forms:

1. Use heat -conducting metal or heat dissipation fins to fit the heat dissipation with LED packaging parts.

2. Add fan to force heat dissipation.

3. Set the circulating liquid heat dissipation in the packaging parts.

4. The combination of thermal pipe in the packaging part can be absorbed or emitted when the working medium in the heat pipe is changed.