1. The LED chip architecture and raw materials are also one of the factors that affect the thermal resistance of the LED point light source module. Reducing the thermal resistance of the LED itself is a prerequisite;

2. Heat sink materials with different thermal conductivity, such as copper, aluminum, etc., have a great influence on the thermal resistance of LEDs. Therefore, choosing a suitable heat sink material is also one of the methods to reduce the thermal resistance of LED components.

3. Even if the same heat sink material is used, it is directly related to the size of the heat dissipation area. The secondary heat dissipation design is good, and the area is large, which correspondingly reduces the thermal resistance, which has a significant effect on the luminous efficiency and lifespan of the LED point light source module. The extension has a great effect.

4. The LED chip is directly connected to the metal with thermal conductive adhesive, and different materials including thermal conductive adhesive and metal will affect the thermal resistance of the LED. Minimize the thermal resistance between the LED and the loading interface of the secondary heat dissipation mechanism.

5. If the working environment temperature of the LED components is too high, it will also affect the thermal resistance of the LED components, so try to reduce the ambient temperature.

6. Selecting certain materials and controlling the technical details such as the rated input power, in order to improve the LED luminous efficiency and prolong the life of the LED, and handle the heat dissipation problem of the LED.

To summarize briefly, we must consider the following points when designing the LED point light source module:

1. Reduce the thermal resistance of the chip. LED side light source LED injection module LED light bar LED waterproof glue filling module Hongyan cab Sany cab Sany Heavy Industry Parts

2. Optimize the hot channel.

a. Channel structure: The shorter the length (L), the better; the larger the area (S), the better; the fewer links, the better; eliminate the heat transfer bottleneck on the channel.

b. The larger the thermal conductivity λ of the channel material, the better.

c. Improve the packaging process to make the interface contact between the channel links closer and more reliable.

3. Strengthen the conduction/heat dissipation function of the electrical channel.

4. Choose light-emitting channel materials with higher guiding/heating efficiency.