1. Soldering conditions The reflow soldering temperature of this product is recommended to be below 260°C, and customers are advised to use low-temperature solder paste. The number of reflow soldering is recommended to be less than 2 times. After the first reflow, it must be cooled to room temperature for the second reflow. After the plate is placed, it must be reflowed within 2 hours. If the circuit board needs to be repaired, it must be controlled within 24H after internal reflow soldering, and it cannot be exposed to excessive air. This product is not recommended for bent circuit boards. Avoid rapid cooling when soldering, avoid any mechanical force or excessive vibration during cooling of LED soldering, and do not bend the board after soldering.

2. The product is glued and extruded. Due to the different hardness and expansion coefficient of each glue, if the final product needs to be dipped or extruded, the light board needs to be placed before the glue and light strip before extrusion. Bake in an oven at 60-80°C for 6-8 hours to completely remove residues such as water vapor on the light board and light strip, and then glue or squeeze to verify product compatibility.

3. It is strongly recommended that customers confirm the first piece before using this product for trial production in small batches. After the finished product passes various tests, it will be put into use in large quantities.

4. Other Precautions Long-term exposure of the LED to sunlight or occasional exposure to violet light may cause the colloid to turn yellow. To ensure the photoelectric performance of the LED, please keep the surface of the LED light-emitting area clean. When designing the circuit, the reverse voltage or large current generated during the switching process should be prevented from impacting the LED instantaneously, and sharp tools such as tweezers should be avoided to contact the gel part during use.