[Scope of application] Applicable to: small household appliances, instruments, equipment, gifts, toys

 【Package】1000pcs/pack of 3mm red and blue two-color common anode LED lamp beads packaging process Choose the appropriate size, luminous rate, color, voltage, current chip,

1. Expand the crystal. Use an expander to expand the entire LED wafer film provided by the manufacturer evenly, so that the closely arranged LED chips attached to the surface of the film are pulled apart, which is convenient for crystal sting.

2. Back glue, place the unfolded crystal ring on the surface of the melter that has scraped the silver paste layer, and put the silver paste on the back. some silver paste. Suitable for bulk LED chips. Use a dispenser to dispense the appropriate amount of silver paste on the PCB printed circuit board.

3. Solid crystal, put the crystal expansion ring prepared with silver paste into the thorn crystal frame, and the operator uses a thorn pen to stab the LED chip on the PCB printed circuit board under the microscope.

4. Fix the crystal, put the perforated PCB printed circuit board into a constant temperature thermal cycle oven for a period of time, and take it out after the silver paste is cured (do not leave it for a long time, otherwise the coating of the LED chip will be baked yellow, that is, oxidized , giving the status would cause difficulty). If there is LED chip bonding, the above steps are required; if only IC chips are bonded, the above steps are canceled.

5. Wire bonding, use an aluminum wire bonding machine to bridge the chip (LED chip or IC chip) with the aluminum wire of the corresponding pad on the PCB, that is, solder the inner lead of the COB.

6. During the initial test, use special test tools (COB has different equipment according to different purposes, the simple one is high-precision regulated power supply) to test the COB board, and rework the unqualified board.

7. Dispensing, using a dispenser to place an appropriate amount of the prepared AB glue on the bonded LED die, encapsulate the IC with black glue, and then encapsulate it according to customer requirements.

8. When curing, place the sealed PCB or lamp holder in a thermal cycle oven for constant temperature. Different drying times can be set as required.

9. For general testing, use special testing tools to test the electrical properties of the packaged PCB or lamp holder, and distinguish whether they are good or bad.