After being used for a long time after being turned on, LED street lights will gradually cause the internal temperature of the LED lights to continuously rise. If the generated heat cannot be dissipated in a timely manner, it will have a significant impact on the service life of the street lights, and in serious cases, it will cause damage to the LED street lights and their holders.

LED light source is the same as the traditional light source. The semiconductor light-emitting Diode (LED) will generate heat during operation, which depends on the overall luminous efficiency. Under the action of external electric energy, the radiation recombination of electrons and holes produces electroluminescence. The light emitted near the PN junction also needs to pass through the semiconductor medium and packaging medium of the chip itself to reach the outside world (air). Based on the comprehensive current injection efficiency, radiation luminescence quantum efficiency, and chip external light extraction efficiency, only about 30-40% of the input electrical energy is converted into light energy, while the remaining 60-70% of the energy is mainly converted into thermal energy in the form of non radiative recombination lattice vibrations.

We believe that the stability and quality of LED lights are crucial to the heat dissipation of the lamp body itself. The natural insert heat sink is often used for the heat dissipation of high brightness LED lights in the market, but the effect is not ideal.

The main structure of LED lamps using LED light sources is composed of LED, heat dissipation structure, driver, lens, and other parts. Therefore, heat dissipation is also an important part, and if LED cannot dissipate heat well, its lifespan will also be affected. Heat management is the main issue in high brightness LED applications. Due to the p-type doping of group III nitrides being limited by the solubility of Mg acceptors and the high starting energy of holes, heat is particularly prone to be generated in the p-type region, which must pass through the entire structure to dissipate on the heat sink; The heat dissipation pathways of LED devices mainly include thermal conduction and convection; The extremely low thermal conductivity of the substrate material leads to an increase in the thermal resistance of the device, resulting in severe self-heating effects and a devastating impact on the performance and reliability of the device. The effect of heat on high brightness LEDs. Heat is concentrated in very small chips, causing an increase in chip temperature, resulting in non-uniform distribution of thermal stress, a decrease in chip luminescence efficiency, and a decrease in fluorescence powder lasing efficiency; When the temperature exceeds a certain value, the device Failure rate increases exponentially.