Raw material: LED bracket; LED chip; LED solid crystal adhesive; Welding line; LED packaging adhesive; LED fluorescent powder; The first and foremost are the above materials.

Equipment: Active solidification machine; Plasma cleaning machine; Active wire welding machine; Active dispensing machine; Glue mixer; Oven; Cutting machine; Active sorting machine; Active packaging machine;

Production environment: LED packaging factories generally have a dust prevention requirement of 100000 yuan; In the dispensing room, there may be a need for higher protection, with the hope of achieving 10000 level dust prevention; The backend testing and sorting requirements are lower, with a million level of dust prevention

Yes. But good electrostatic protection is required throughout the entire process, as LED chips are afraid of electrostatic breakdown.

Step 1: Inspection of LED mounting brackets for SMD LED beads. The primary test items include appearance scale, plating thickness, and whether there is oxidation phenomenon. Advocate to use tools: anime measuring instrument, film thickness tester, metallographic microscope.

Step 2: SMD LED Beads LED Bracket Baking. The primary purpose of using equipment to bake the LED bracket is to remove any residual moisture during the injection molding process.

Step 3: Chip LED Beads LED Bracket Plasma Cleaning. The primary task of plasma cleaning is to form an arc of hydrogen and oxygen inside the equipment, removing residual organic matter on the surface of the LED bracket and improving the adhesion of the solid crystal.

Step 4: SMD LED lamp beads for crystal fixation. Attach the LED chip to the LED bracket through an active crystal fixing machine using LED crystal fixing adhesive.

Step 5: SMD LED lamp beads baking. Bake the solid crystal adhesive dry to form a good bond between the LED chip and the LED bracket. After baking, a solid crystal thrust test should be conducted, and the equipment used is very expensive, such as a push and pull tester.